TDK Corporation launched a complete portfolio of VR sensors enabling a new class of highly accurate and affordable all-in-one VR solutions, at the CES 2019.

For any VR system, it’s crucial to have precise alignment between the Head-Mounted-Display (HMD) and the Handheld Controllers. This means that even the slightest head or the most extreme hand movement needs to be measured fast and accurately, to allow the immediate rendering of the changed VR scenery.

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The key platform components are:

• InvenSense ICM-42688 6-axis motion sensor for HMDs provides the lowest noise figure in the industry and features the only high-resolution measurement mode, enabling the measurement of VR headset movement with unprecedented accuracy.
• InvenSense ICM-42686 6-axis motion sensor for VR contro
• llers provides the industry’s only extended range motion measurement mode, enabling the accurate tracking of the handheld controller movement at any speed.
• Chirp Microsystem’s ultralow power CH-101 ultrasonic transceiver coupled with Chirp’s SonicTrack™ system is the only time-of-flight based inside-out tracking solution for all-in-one VR systems that delivers true 3D positioning between the head-mounted-display and the handheld controllers.
• TDK Sensor Fusion software that processes the sensor inputs simultaneously to create a simple, fused output that describes the exact 3D position and movement of all VR HW components and runs on commercial application processors.
• TDK TMR sensing elements that enable magnetometers with significantly higher resolution than traditional Hall-effect based magnetometers, thereby enabling the exact determination of the orientation changes of the HMD and controllers.

TDK all-in-one VR platform also sets new standards with respect to small size, low weight, and reduced Bill-of-Materials (BOM), which taken together enable the most affordable and wearable all-in-one VR systems in the industry, said a press release.

“At this year’s CES show we’re announcing innovative VR solutions with some of the world’s leading VR system providers like HTC and platform enablers like Qualcomm, and together we’re shaping the all-in-one AR/VR/XR space,” said Behrooz Abdi, president and general manager of MEMS sensors business group at TDK.

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Wearable Technologies AG CEO Christian Stammel will also be at the CES 2019. He will moderate the session “Putting Wearables To Work” at the Wearable Tech Summit, a CES 2019 Conference track, on January 9th, 2019. Our 33rd edition of the WT Conference will be bigger than ever with more than 1.500 m2 floor space and over 80.000 visitors from WT and ISPO integrated into the brand-new innovation hall C6 of the Munich Tradeshow. More than 60 high-level speakers coming from Bayer, BMW, Casio, Gore, Microsoft, and STMicroelectronics will give you latest insights in their applications and digitalization strategies via IoT and WT solutions and drive your business development. In the afternoon of the first day, you will get also the chance to be connected to 30 future stars of our ecosystem via our annual IOT/WT INNOVATION WORLD CUP® pitch and award ceremony.

Register here https://www.wearable-technologies.eu/ with 20% discount by using the code WT20