Mr. Hackler is President and CEO of American Semiconductor and co-inventor of Semiconductor-on-Polymer™ ultra-thin CSP. He is currently leading development of next-generation organic and flexible substrates for biomedical, defense, and aerospace systems. He brings more than 30 years of experience across wafer fabrication, advanced substrates, packaging, assembly, test, and commercialization, with leadership roles at American Semiconductor, M/A-Com, Zilog, Intel, Nortel, and General Instrument. Doug holds engineering degrees from the University of Idaho and Boise State University, and a business degree from Texas Tech University.